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For over 40 years Intel has been leading and bringing new technology to the marketplace. Now we are building on our historical strength in silicon innovation and global manufacturing capacity to create new products and technologies that help people live happier, more productive lives.

When you work for Intel, you join a company where your career — and your life — can benefit from long-term stability and continual growth. Intel lets you play a role in developing and supporting industry-leading innovations while working with diverse people around the world.

Intel in the United Kingdom offers undergraduates and graduates many chances for growth and learning while working with industry-leading innovation. Of course Intel requires a dedicated team of professionals, not just in Engineering but also across a whole range of disciplines – from Finance to Marketing, Human Resources to Logistics and Sales to Operations and IT.

Latest jobs

SWA platform engineer (Intern)

Location: Shanghai, china

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Intel (China)

Shanghai CHINA

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SWA platform engineer (Intern)

Location:
(CHINA) and Beijing
Job Reference:
10363
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

In this position, you will join in Intel Wireless Software team. You will work on building wireless base station architecture/Cloud RAN infrastructure, innovative algorithm and simulation platforms.
As a Wireless Software team member, you will focus on:
- 4G/5G base station PHY software design and implementation
- 4G/5G link level and system level algorithm design and simulation platform development
- System level integration wireless performance and computation performance level setting and performance tuning

Qualifications

- Master in telecommunication, computer science or electrical engineering, or related domains
- Familiar with air interface algorithm design; Familiar with 4G or 5G NR is a big plus
- Experience of link level and system level simulation development
- Good verbal communication and technical writing skills in Chinese and English
- Ability to work independently and in a team environment
- Fast learning capability

Inside this Business Group

The Data Center Group (DCG) is at the heart of Intel’s transformation from a PC company to a company that runs the cloud and billions of smart, connected computing devices. The data center is the underpinning for every data-driven service, from artificial intelligence to 5G to high-performance computing, and DCG delivers the products and technologies—spanning software, processors, storage, I/O, and networking solutions—that fuel cloud, communications, enterprise, and government data centers around the world.

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Electrnic Package Engineering Undergraduate Internship 2020

Location:
(CHINA) and Shanghai
Job Reference:
10362
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

The Non-Volatile Memory group in Shanghai, PRC is looking for a full-time paid intern to support NSG Package Pathfinding and Development team projects including silicon/packaging interaction, assembly process solutions, DOEs execution and coordination with Fab, Intel assembly subcontractors to fulfill assembly process development project objectives, ensuring project schedules and on-time qualification to achieve new product and package transfer to high volume manufacturing. . Additional project responsibilities will be added once project begins.

Qualifications

Minimum Qualifications:

- The candidate must be pursuing a BS or MS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering or related field.
- The candidate must have the unrestricted right to work in the PRC. without requiring sponsorship.

Preferred Qualifications:

- 3+ months of experience in electronic materials processing.
- 3+ months of experience in IC fabrication process.
- 3+ months of experience in electronic packaging materials and/or assembly process.
- 3+ months of experience in fast paced environment.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.

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Program Analyst (Intern)

Location:
(CHINA) and Shanghai
Job Reference:
10361
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

Program Analyst is responsible for supporting the program management and coordination in IoTG China. The successful candidate will work closely with PM, Intel team members on program planning and execution

Inside this Business Group

Employees of the Internet of Things Solutions Group (IOTG) have an exciting opportunity before them: To grow Intel's leadership position in the rapidly evolving IoT market by delivering the best silicon, software and services that meet a wide range of customer requirements - from Intel® Xeon® to Intel® Quark®. The group, a fresh, dynamic collaboration between Intel's Intelligent Solutions Group and Wind River Systems, utilizes assets from across all of Intel in such areas as industrial automation, retail, automobiles and aerospace. The IOTG team is dedicated to helping Intel drive the next major growth inflection through productivity and new business models that are emerging as a result of IoT.