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SWA platform engineer (Intern)

Location: Shanghai, china

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Intel (China)

Shanghai CHINA

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Electrnic Package Engineering Undergraduate Internship 2020

Location:
(CHINA) and Shanghai
Job Reference:
10362
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

The Non-Volatile Memory group in Shanghai, PRC is looking for a full-time paid intern to support NSG Package Pathfinding and Development team projects including silicon/packaging interaction, assembly process solutions, DOEs execution and coordination with Fab, Intel assembly subcontractors to fulfill assembly process development project objectives, ensuring project schedules and on-time qualification to achieve new product and package transfer to high volume manufacturing. . Additional project responsibilities will be added once project begins.

Qualifications

Minimum Qualifications:

- The candidate must be pursuing a BS or MS degree in Materials Science, Metallurgical Engineering, Ceramic Engineering, Chemical Engineering, Mechanical Engineering or related field.
- The candidate must have the unrestricted right to work in the PRC. without requiring sponsorship.

Preferred Qualifications:

- 3+ months of experience in electronic materials processing.
- 3+ months of experience in IC fabrication process.
- 3+ months of experience in electronic packaging materials and/or assembly process.
- 3+ months of experience in fast paced environment.

Inside this Business Group

Non-Volatile Solutions Memory Group:  The Non-Volatile Memory Solutions Group is a worldwide organization that delivers NAND flash memory products for use in Solid State Drives (SSDs), portable memory storage devices, digital camera memory cards, and other devices.  The group is responsible for NVM technology design and development, complete Solid State Drive (SSD) system hardware and firmware development, as well as wafer and SSD manufacturing.