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For over 40 years Intel has been leading and bringing new technology to the marketplace. Now we are building on our historical strength in silicon innovation and global manufacturing capacity to create new products and technologies that help people live happier, more productive lives.

When you work for Intel, you join a company where your career — and your life — can benefit from long-term stability and continual growth. Intel lets you play a role in developing and supporting industry-leading innovations while working with diverse people around the world.

Intel in the United Kingdom offers undergraduates and graduates many chances for growth and learning while working with industry-leading innovation. Of course Intel requires a dedicated team of professionals, not just in Engineering but also across a whole range of disciplines – from Finance to Marketing, Human Resources to Logistics and Sales to Operations and IT.

 

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Graduate Trainee

Location: malaysia

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Intel (Malaysia)

,CA 95054-1549
MALAYSIA

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Graduate Trainee

Location:
(MALAYSIA) and various
Job Reference:
3373
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

Your specific responsibilities may include but are not limited to the following:-Create reference designs that ship to customers with highest quality, relevant and time to market.-Manage various stake holders that his/her deliverables are dependency of reference design-Develop and validate Linux drivers for various IPs such as Ethernet, PCIe, USB.-Able to troubleshoot Linux apps and drivers issue-Maintain and create various build for reference designs which include Linux and bootloaders


Qualifications

Successful candidate's qualifications should include the following:-Familiar with embedded development environment such as git, Linux host.-Understanding of Linux driver and application development.-Able to troubleshoot various kernel issue with the help of gdb server or host based debugger-Able to script with Perl, python-Familiarize with build script and infrastructure. Understanding of Angstrom and Yocto build system would be a plus.-Familiarization with PCIe, Ethernet, Display port will be a plus-Understanding of AMP and SMP system, virtualization would be a plus-Experience on open source upstreaming would be a plus

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JR0019191 - Chip to Chip IP Intern PIPE

Location:
(MALAYSIA) and various
Job Reference:
3372
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

PSG-PIPE team develops optimized intellectual property IP cores and reference design examples, that gets integrated with in-house software development tools Quartus Prime. The pre-defined design building blocks, known as intellectual property IP cores, can be licensed by customers to add standard functions to their PLD designs. IPs, including Ethernet, PCIe, JESD204B and DDRx, enable chip-to-chip, board-to-board, or box-to-box connectivity in system designs. They satisfy the needs of a broad spectrum of applications and leverage the integrated transceivers in our FPGA and ASIC devices. You will be part of an engineering team that focuses on developing state-of-the-art IPs. You will be working on advanced device architectures, design definition, implementation and verification. You will also be developing design examples, simulation models, accompanied by a rich set of technical documentation.Duties1. Co-develop tools and scripts to enhance IP development flow2. Participate in design development tasks throughout the IP development flow


Qualifications

Job Description Summary 1. Undergoing EE, CE or CS, or equivalent.2. Basic knowledge of digital logic design is a must.3. Familiarity or experience in RTL design with Verilog and/or VHDL is a plus.4. Familiarity with Perl, C++, Java and shell scripts is a plus.5. Strong skills in communication, initiative, promote innovation and teamwork.6. Highly motivated to learn and adapt to fast-changing technologies and environments.Demonstrates fundamental values such as accountability, integrity and a winning mindset

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Thermal and Mechanical Graduate Trainee

Location:
(MALAYSIA) and various
Job Reference:
3371
Functional Area/Experience:
IT / Fresh Graduate
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Job Description:

Job Description & Qualifications

IOTG System Integration Validation Engineering is looking for Technical Graduate candidate for Thermal and Mechanical. In this position, the candidate will be exposed to the design of thermal & mechanical on Intel product, customer reference and validation boards within the Internet of Things GroupIOTG. Candidate will be involved for the whole product design life cycle from the design phaserequirement definition, component selection, circuit design, schematic capture, system Bill of MaterialsBOM definition till production.


Qualifications

- You must possess a BSc or MSc in Thermal and Mechanical Engineering
- Basic understanding of Thermodynamics, Fluid Mechanics, Mechanical Engineering
- Intermediate level of heat transfer and Solidworks 3D modeling
- Hands on PC/platform/Hardware setup and thermal metrology/testing, sampling data and provide statistical analysis.
- Able to speak/present and write technical papers in English.
- Proficient in MSOffice
- Ability to work both independently and in a cross functional team environment.
- Strong work ethics, team player
- Strong initiative, self-motivated and able to multi-task


Inside this Business Group

Employees of the Internet of Things Solutions Group (IOTG) have an exciting opportunity before them: To grow Intel's leadership position in the rapidly evolving IoT market by delivering the best silicon, software and services that meet a wide range of customer requirements - from Intel® Xeon® to Intel® Quark®. The group, a fresh, dynamic collaboration between Intel's Intelligent Solutions Group and Wind River Systems, utilizes assets from across all of Intel in such areas as industrial automation, retail, automobiles and aerospace. The IOTG team is dedicated to helping Intel drive the next major growth inflection through productivity and new business models that are emerging as a result of IoT.